éolane group continues to invest in the second semester to further improve the quality of its production. In September, the Douarnenez site equipped its CMS line with a 3D SPI (Solder Paste Inspection) and a 3D AOI (Automatic Optic Inspection). éolane has chosen the SIGMAX and XCEED laser scanning systems from PARMI, a benchmark in the field of 3D optical inspection and one of the world leaders. The aim of éolane group is to make the CMS process more reliable by detecting faults as early as possible, allowing rapid feedback loops and thus improving the quality of its production.
Strength of Laser Scanning Method
1. Inspection irrelevant of Color, Material, and Surface Roughness
Height acquisition regardless of color, material, and surface roughness with highly focused and uniform line beams to measure the entire surface of the object
2. 3D Imaging of Laser Profiles using MPC (Multi Profile Correlation)
Height acquisition of the object by PARMI’s unique laser profiling technology to measure the exact base
3. PCB Warpage Inspection with the Real-time Z-axis Tracking Function
The industry’s first utilization of the real-time Z-axis for PCB warpage inspection
Optimized for Z-axis control with the industry’s lightest, most-compact sensor head (3.5kg)
Real-time Warpage Tracking
4. 3D Imaging of High Components by Multi-Step Scanning Function
Z-axis measurement to prevent images of components higher than 5mm from getting blurry
5. Perfect Shadow Effect Removal
Shadow effect removal by using dual lasers with narrow projection angles
6. Minimization of Image Distortion Caused by External Environment After Soldering
PARMI’s TRSC sensor head featuring a short exposure time
No image distortion by high-temperature PCBs immediately after soldering
No influence of external light interference