The CENTER region is made up of two production sites based in Angers and Combrée.
This region brings together the skills necessary to manufacture complete and complex electronic products, ranging from electronic boards wiring to boards and systems testing and finished products integration. With an engineering office, the CENTER Region is specialized in the industrialisation and manufacture of encapsulated microelectronic solutions.
Expertise
- Chip On Board
- Product / Process Industrialisation
- A610 Classe 3 PCBA - Defense - Nuclear - Medical - Aeronautical
- Complex integration (sub-assemblies, interconnection) of Cabinets or Racks
- From very small series / low recurrence (OF <10pcs) to large series (OF> 500pcs)
- Test Strategy
- Power Electronics
- Radio Frequency
- Test benches development
R&D Specific skills
- Project management
- DFM (Design For Manufacture), DFT (Design For Test)
- Prototypes - short cycle
- Production tests, reliability tests
- Compliance with specifications
- Experience plans, validation reports
- Manufacturing and control record
- Industrial development: manufacturing process, resources, tools, test or simulation software
- Analysis of test coverage and proposal of an optimized test strategy (Testway)
- Plastics design / Average test design
- JTAG, functional test, tightness, endurance, vibration, ICT, temperature ...
- Measurements traceability
Other skills
- Electric actuator control / command
- Very low power architecture
- Analog electronics very weak signals
- GUI
- Power electronics (from 1kw to 100 Kw)
- Dependability
- Connected objects / Radio Frequency
- CMMI level 2 project management
- Lighting
- Duplication very small series
- Certification laboratory (Qualification Lab by éolane)
- Maintenance in Operational Condition
Production tools
Expert in the subcontracting of PCBA manufacturing from small to large series, the éolane CENTER Region has at its disposal a wide range of technologies to support its customers throughout the life cycle of their products.
- 7 SMD lines with a capacity of 150,000 components / h (vacuum furnace, vacuum vapor phase, standard reflow)
- 5 laminar selective waves (ROHS)
- 2 laminar waves
- 1 selective wave
- Means of control: SPI, AOI, X-ray and Xpress by intuitive inspection
- Test means: Takaya, Genrad, Spectrum, Synor, specific functional tests
- Process automation: collaborative robots
- 3 cobots (integrating, dispensing and screwing)
- 2 COB lines (Chip On Board)
- ISO 8 cleanroom
- 5 micro-electronic wiring means (from 32 to 300 µm)
- 1 certification laboratory
- Coating capacity (manual and automatic class 3)
- 10 integration lines with fully digitized test and work instructions
- Climatic chambers: 7 plus 2 for thermal shock
- Chip depositing machine (plug on wafer)